Thermal imaging cameras, that have been specifically developed to find faults in electric systems and electromechanical devices, are used for the purpose of even faster and more efficient fault detection. These cameras help our technicians to detect thermal weak points in electronic modules while working in our in-house repair workshop as well as when working at the customer's site.
The compact and flexible InCircuit/function test system can be used to locate faults on digital and hybrid-equipped circuit boards. The function of the individual ICs is tested with test clips. The use of PinPoint diagnostic technology ensures a fast and efficient fault analysis is completed and its excellent fault detection rate means that it is particularly reliably for intense testing phases and sporadic errors.
By using the rework station, it is possible to unsolder ball grid arrays (BGAs) from modules, to reball them or to replace them with new BGAs and resolder them as part of a semi-automated process. The system ensures that all of the neighbouring components are exposed to minimal thermal loads during the unsoldering and soldering process. As the process is semi-automated, it can be repeated with complete accuracy if it has been programmed.
The integrated Dip&Print station ensures that the optimum amount of flux paste is applied to the BGA providing an excellent soldering result and minimal contamination.
The adapter-free and continuous test system is used to quickly find production faults and repair assembled circuit boards. Fault diagnosis is fully automated. An X/Y/Z-controlled testing probe approaches the specified test points at high speed ensuring that open lines, short circuits and component faults can be identified clearly.
The VI measurement instrument is used to test and diagnose faulty components by measuring in-circuit signatures. 3D scans of the components are completed during this process so that a snapshot of the current/voltage characteristic can be determined at a fixed frequency.
A three-dimensional characteristic curve is also recorded with a variable frequency as the Z-axis. The measurement instrument thus enables integrated circuits (IC) to be measured virtually, creating a pin-to-pin measurement at the same time. Frequency-dependent components are thus scanned across a large range and an IC can be recorded in all variables within seconds. All of the characteristic curves are saved during this process and can be called up again for subsequent test sequences.
For the purpose of quality assurance, test flows are programmed for the modules so that consistent quality can be guaranteed when troubleshooting and resolving faults for our customers.